[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"$fF8PtcA5HJhumokJU4-hhd384dD3LxjbiC7w9LnHH3Jk":3},{"id":4,"source":5,"question":6,"options":7,"answer":12,"related":13,"type":24,"origin":110,"createTime":26},156845961,"v1","以下不属于导线架制程的是",[8,9,10,11],"冲压(Stamping)","化学蚀刻(Etching)","气相外延生长","电镀(plating)",[],[14,27,37,47,57,67,71,79,89,99],{"id":15,"source":5,"question":16,"options":17,"answer":22,"related":23,"type":24,"origin":25,"createTime":26},156845956,"以下不属于陶瓷金属化的方法的是",[18,19,20,21],"外延生长法","厚膜法","薄膜法","直接敷铜法",[],[],0,null,"2024-07-01T11:58:44+08:00",{"id":28,"source":5,"question":29,"options":30,"answer":35,"related":36,"type":24,"origin":25,"createTime":26},156845957,"在EMC材料中占比最多的是",[31,32,33,34],"硬化剂","填料","环氧树脂","脱模剂",[],[],{"id":38,"source":5,"question":39,"options":40,"answer":45,"related":46,"type":24,"origin":25,"createTime":26},156845958,"芯片封装中,材料间热膨胀系数的差异容易引起",[41,42,43,44],"润滑不良","电子干扰","弯曲变形","疲劳裂纹",[],[],{"id":48,"source":5,"question":49,"options":50,"answer":55,"related":56,"type":24,"origin":25,"createTime":26},156845959,"以下不属于底部填充对于材料特性要求的是",[51,52,53,54],"良好的流动性","适当的韧性和强度","降低芯片和基材的CTE之差","透光性良好",[],[],{"id":58,"source":5,"question":59,"options":60,"answer":65,"related":66,"type":24,"origin":25,"createTime":26},156845960,"在高剪切速率下粘度很快降低,当剪切作用停止粘度能迅速上升.这种材料特性称为",[61,62,63,64],"流动性","热固性","触变性","热塑性",[],[],{"id":4,"source":5,"question":6,"options":68,"answer":69,"related":70,"type":24,"origin":25,"createTime":26},[8,9,10,11],[],[],{"id":72,"source":5,"question":73,"options":74,"answer":77,"related":78,"type":24,"origin":25,"createTime":26},156845962,"典型的基板制造程序主要可分为减成制程(Subtractive Process)和加成法制程 (Additive Process)两种.其中,哪种方法制成的线宽线距更小",[75,76],"减成法","加成法",[],[],{"id":80,"source":5,"question":81,"options":82,"answer":87,"related":88,"type":24,"origin":25,"createTime":26},156845963,"网印制程途中可能产生气泡问题且不易解决,对此提出的解决方式是",[83,84,85,86],"高温加热","真空网印","增加材料用量","减少材料用量",[],[],{"id":90,"source":5,"question":91,"options":92,"answer":97,"related":98,"type":24,"origin":25,"createTime":26},156845964,"芯片结构中,提供芯片承载并与外部电路相连的结构称为",[93,94,95,96],"金线","导线架","封装基板","底填胶Underfill",[],[],{"id":100,"source":5,"question":101,"options":102,"answer":108,"related":109,"type":24,"origin":25,"createTime":26},156845965,"以下不属于封装基板常用材料的是",[103,104,105,106,107],"环氧(FR-4)基板","铝基板","Aramid 纤维基板","陶瓷蕊基板","BT基板",[],[],{"courseName":111,"courseImg":112,"workName":113,"workId":114,"count":115,"courseId":116},"半导体芯片项目驱动创新班（第三期）","https:\u002F\u002Ftihai-oss-cloud.itihey.com\u002Fimg\u002F25b30343053994e8940089572d36015b.jpg","章节小测4","work_35816039",10,"89afd96ea6e9007ebed40ea4088b8e48"]