[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"$fjto0g-7Nh7LzjybBmsEcWprVf1EWmHUoTMzAiJJLnNM":3},{"answer":4,"createTime":5,"id":6,"options":7,"origin":12,"question":16,"related":17,"source":27,"type":28},[],"2026-04-07 11:18:16",335524231,[8,9,10,11],"减小封装厚度","提高芯片散热性能","增加芯片机械强度","便于后续划片操作",{"courseId":13,"courseImg":14,"courseName":15},"53e1d2ef4961cca8eea3e23969ad2cb9","https:\u002F\u002Ftihai-oss-cloud.itihey.com\u002Fimg\u002F03a579384a6dc297c89809b582fcc767.png","默认课程","晶圆减薄的主要目的不包括以下哪一项",[18,29,38,47,56,59,67,76,84,93],{"answer":19,"createTime":5,"id":20,"options":21,"question":26,"source":27,"type":28},[],335524227,[22,23,24,25],"机械划片","激光划片","等离子体刻蚀划片","水射流划片","以下哪种划片方式适用于硬脆材料如硅晶圆","v1",0,{"answer":30,"createTime":5,"id":31,"options":32,"question":37,"source":27,"type":28},[],335524228,[33,34,35,36],"刀片磨损情况","刀片平整度","刀片安装紧固度","以上都是","划片机的金刚石刀片需要定期检查的项目是",{"answer":39,"createTime":5,"id":40,"options":41,"question":46,"source":27,"type":28},[],335524229,[42,43,44,45],"金","银","铜","铝","最常用的引线键合材料是",{"answer":48,"createTime":5,"id":49,"options":50,"question":55,"source":27,"type":28},[],335524230,[51,52,53,54],"研磨垫","冷却水管","电机轴承","控制面板","减薄机维护中,需要定期更换的部件是",{"answer":57,"createTime":5,"id":6,"options":58,"question":16,"source":27,"type":28},[],[8,9,10,11],{"answer":60,"createTime":5,"id":61,"options":62,"question":66,"source":27,"type":28},[],335524232,[63,64,65,36],"保护晶圆表面免受划片损伤","固定晶圆便于操作","防止划片时碎片飞溅","晶圆贴膜的主要作用是",{"answer":68,"createTime":5,"id":69,"options":70,"question":75,"source":27,"type":28},[],335524233,[71,72,73,74],"模具表面","料筒","加热板","电源线","塑封机维护中,需要定期清洁的部件不包括",{"answer":77,"createTime":5,"id":78,"options":79,"question":83,"source":27,"type":28},[],335524234,[80,81,82,36],"分离单个封装体","形成引脚形状","去除多余框架材料","切筋成型的目的是",{"answer":85,"createTime":5,"id":86,"options":87,"question":92,"source":27,"type":28},[],335524235,[88,89,90,91],"环氧树脂","硅胶","陶瓷","金属","芯片塑封的主要材料是",{"answer":94,"createTime":5,"id":95,"options":96,"question":100,"source":27,"type":28},[],335524236,[97,98,99,36],"固定芯片位置","实现芯片与基板的电气连接","提高散热效率","芯片粘接过程中,导电胶的主要作用是"]