[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"$f2t4W_D60EGbuSucMSaQdM2G68FAcGMVAOzY8cNxEOzk":3},{"answer":4,"createTime":5,"id":6,"options":7,"origin":8,"question":12,"related":13,"source":19,"type":20},[],"2026-05-19 16:47:00",377736793,[],{"courseId":9,"courseImg":10,"courseName":11},"53e1d2ef4961cca8eea3e23969ad2cb9","https:\u002F\u002Ftihai-oss-cloud.itihey.com\u002Fimg\u002F03a579384a6dc297c89809b582fcc767.png","默认课程","塑料封装",[14,21,24,29,34,39,44,49,54,59],{"answer":15,"createTime":5,"id":16,"options":17,"question":18,"source":19,"type":20},[],377736791,[],"电镀","v1",5,{"answer":22,"createTime":5,"id":6,"options":23,"question":12,"source":19,"type":20},[],[],{"answer":25,"createTime":5,"id":26,"options":27,"question":28,"source":19,"type":20},[],377736797,[],"引线键合",{"answer":30,"createTime":5,"id":31,"options":32,"question":33,"source":19,"type":20},[],377736799,[],"气密性封装",{"answer":35,"createTime":5,"id":36,"options":37,"question":38,"source":19,"type":20},[],377736801,[],"失效验证",{"answer":40,"createTime":5,"id":41,"options":42,"question":43,"source":19,"type":20},[],377736803,[],"CSP(芯片级封装)",{"answer":45,"createTime":5,"id":46,"options":47,"question":48,"source":19,"type":20},[],377736805,[],"切筋成型",{"answer":50,"createTime":5,"id":51,"options":52,"question":53,"source":19,"type":20},[],377736807,[],"晶圆级封装(WLP)",{"answer":55,"createTime":5,"id":56,"options":57,"question":58,"source":19,"type":20},[],377736808,[],"封帽",{"answer":60,"createTime":5,"id":61,"options":62,"question":63,"source":19,"type":20},[],377736811,[],"SiP(系统级封装)"]