[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"$f5VP2ySZT5YOeT6neyxA1yjIIMArUZtXLcLg5inZcZsM":3},{"answer":4,"createTime":5,"id":6,"options":7,"origin":8,"question":12,"related":13,"source":19,"type":20},[],"2026-05-19 16:47:00",377736808,[],{"courseId":9,"courseImg":10,"courseName":11},"53e1d2ef4961cca8eea3e23969ad2cb9","https:\u002F\u002Ftihai-oss-cloud.itihey.com\u002Fimg\u002F03a579384a6dc297c89809b582fcc767.png","默认课程","封帽",[14,21,26,31,36,41,46,51,56,59],{"answer":15,"createTime":5,"id":16,"options":17,"question":18,"source":19,"type":20},[],377736791,[],"电镀","v1",5,{"answer":22,"createTime":5,"id":23,"options":24,"question":25,"source":19,"type":20},[],377736793,[],"塑料封装",{"answer":27,"createTime":5,"id":28,"options":29,"question":30,"source":19,"type":20},[],377736797,[],"引线键合",{"answer":32,"createTime":5,"id":33,"options":34,"question":35,"source":19,"type":20},[],377736799,[],"气密性封装",{"answer":37,"createTime":5,"id":38,"options":39,"question":40,"source":19,"type":20},[],377736801,[],"失效验证",{"answer":42,"createTime":5,"id":43,"options":44,"question":45,"source":19,"type":20},[],377736803,[],"CSP(芯片级封装)",{"answer":47,"createTime":5,"id":48,"options":49,"question":50,"source":19,"type":20},[],377736805,[],"切筋成型",{"answer":52,"createTime":5,"id":53,"options":54,"question":55,"source":19,"type":20},[],377736807,[],"晶圆级封装(WLP)",{"answer":57,"createTime":5,"id":6,"options":58,"question":12,"source":19,"type":20},[],[],{"answer":60,"createTime":5,"id":61,"options":62,"question":63,"source":19,"type":20},[],377736811,[],"SiP(系统级封装)"]