[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"$fHmY0Hzvm8BwUvXdXXOxf8FqCOneMXRz4Zb2K9G77Q5M":3},{"answer":4,"createTime":5,"id":6,"options":7,"origin":8,"question":12,"related":13,"source":19,"type":20},[],"2026-05-19 16:47:05",377737347,[],{"courseId":9,"courseImg":10,"courseName":11},"53e1d2ef4961cca8eea3e23969ad2cb9","https:\u002F\u002Ftihai-oss-cloud.itihey.com\u002Fimg\u002F03a579384a6dc297c89809b582fcc767.png","默认课程","划片工艺的目的是将整片晶圆分割成独立的____",[14,21,26,31,36,41,46,51,56,59],{"answer":15,"createTime":5,"id":16,"options":17,"question":18,"source":19,"type":20},[],377737331,[],"塑封工艺需要在洁净度和____受控的环境中进行","v1",2,{"answer":22,"createTime":5,"id":23,"options":24,"question":25,"source":19,"type":20},[],377737332,[],"常见无损分析技术包括X射线、扫描声学显微镜和____",{"answer":27,"createTime":5,"id":28,"options":29,"question":30,"source":19,"type":20},[],377737335,[],"楔形键合的第一键合点形状是____形",{"answer":32,"createTime":5,"id":33,"options":34,"question":35,"source":19,"type":20},[],377737337,[],"____是多个具有不同功能的芯片(如处理器、存储器、射频芯片等)和无源元件(如电阻、电容、滤波器)通过高密度互连技术,集成在同一个封装体",{"answer":37,"createTime":5,"id":38,"options":39,"question":40,"source":19,"type":20},[],377737339,[],"小外形封装的缩写是____",{"answer":42,"createTime":5,"id":43,"options":44,"question":45,"source":19,"type":20},[],377737341,[],"20.封装材料的疲劳寿命是指在____载荷下的寿命",{"answer":47,"createTime":5,"id":48,"options":49,"question":50,"source":19,"type":20},[],377737343,[],"引线键合失效模式有键合脱落和____",{"answer":52,"createTime":5,"id":53,"options":54,"question":55,"source":19,"type":20},[],377737345,[],"划片前,在晶圆背面粘贴一层薄膜用于固定芯片,该薄膜称为____膜",{"answer":57,"createTime":5,"id":6,"options":58,"question":12,"source":19,"type":20},[],[],{"answer":60,"createTime":5,"id":61,"options":62,"question":63,"source":19,"type":20},[],377737349,[],"引线键合是利用金属线实现芯片焊盘与外部____电气互连的工艺"]