[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"$fP71xVT6Wogh2UilG9IjpdX9VS6c-YtDPxzA_I6dtHmQ":3},{"answer":4,"createTime":5,"id":6,"options":7,"origin":10,"question":16,"related":17,"source":27,"type":32},[],"2023-12-11 12:48:35",985086154,[8,9],"对","错",{"courseId":11,"courseImg":12,"courseName":13,"workId":14,"workName":15},"1000077590","https:\u002F\u002Ftihai-oss-cloud.itihey.com\u002Fimg\u002F45147735439e1eefbccee5904f24b65a.png","集成电路封装与测试技术","56839297","第二章单元测试","载带自动焊使用的凸点形状一般有蘑菇凸点和柱凸点两种.( )",[18,29,33,38,43,53,62,67,72],{"answer":19,"createTime":5,"id":20,"options":21,"question":26,"source":27,"type":28},[],985086153,[22,23,24,25],"干式抛光技术","热压技术","切割技术","光刻技术","下面选项中硅片减薄技术正确的是( )","v2",0,{"answer":30,"createTime":5,"id":6,"options":31,"question":16,"source":27,"type":32},[],[8,9],3,{"answer":34,"createTime":5,"id":35,"options":36,"question":37,"source":27,"type":32},[],985086155,[8,9],"去飞边毛刺工艺主要有:介质去飞边毛刺、溶剂去飞边毛刺、水去飞边毛刺.( )",{"answer":39,"createTime":5,"id":40,"options":41,"question":42,"source":27,"type":32},[],985086157,[8,9],"芯片互联常用的方法有:引线键合、载带自动焊、倒装芯片焊.( )",{"answer":44,"createTime":5,"id":45,"options":46,"question":51,"source":27,"type":52},[],985086171,[47,48,49,50],"五边形","楔形","星形","锥形","键合常用的劈刀形状,下列说法正确的是( )",1,{"answer":54,"createTime":5,"id":55,"options":56,"question":61,"source":27,"type":28},[],985086174,[57,58,59,60],"更便于分析芯片种类","芯片外观更好看","便于识别国家,编号等信息","清晰直观,不容易擦除","以下不属于打码目的的是( )",{"answer":63,"createTime":5,"id":64,"options":65,"question":66,"source":27,"type":32},[],985086176,[8,9],"去毛飞边工艺指的是将芯片多余部分进行有效的切除.( )",{"answer":68,"createTime":5,"id":69,"options":70,"question":71,"source":27,"type":32},[],985086178,[8,9],"封装工序一般可以分成两个部分:包装前的工艺称为装配或称前道工序,在成型之后的工艺步骤称为后道工序.( )",{"answer":73,"createTime":5,"id":74,"options":75,"question":80,"source":27,"type":28},[],985086180,[76,77,78,79],"磨片、划片、装片、键合、塑封、电镀、切筋、打弯、测试、包装、仓检、出货","划片、装片、键合、塑封、电镀、包装、仓检、出货、磨片、切筋、打弯、测试","仓检、出货、磨片、切筋、打弯、测试、划片、装片、键合、塑封、电镀、包装","电镀、切筋、打弯、测试、包装、仓检、出货、磨片、划片、装片、键合、塑封","封装的工艺流程为( )"]